|
|
|
|
|
|
|
Figure 2.28
The Intel Pentium, iCOMP Index 815. This 100 Mhz processor uses f =
0.6m and 4-layer metal BiCMOS. The chip size is 12.7 ´ 12.7 mm, or 163
mm2. Photo courtesy of the Intel Corporation. |
|
|
|
|
|
|
|
|
cover a spectrum from small air-cooled systems to the high-end examples cited in Table 2.4. Two state-of-the-art microprocessors are shown in Figures 2.28 and 2.29. These photomicrographs also show area allocation for various functions. |
|
|
|
|
|
|
|
|
The following example illustrates one approach to high-speed mainframe technology. |
|
|
|
|
|
|
|
|
Mainframe Example: Hitachi M-880 |
|
|
|
|
|
|
|
|
The basic processor (instruction processor) fits on a module (10.6 cm ´ 10.6 cmabout 4 inches on a side) and houses about 40 die, each containing up to 12K gates and each consuming about 20 watts. In order to cool the module (800 watts), the chips are sealed in helium gas and chilled water is |
|
|
|
|
|
